+604-399 3343

may@akty.com.my

Home
About
Projects
Services
Gallery
Videos
News
Contact
AKTY Technologies Sdn Bhd
Home
About
Projects
Services
Gallery
Videos
News
Contact

Multiple Wire Saw To Slice Substrate To Thin Plates

  2. Our Services
  3. Engineering Services (Ultimate Surface Finish)
  4. Multiple Wire Saw To Slice Substrate To Thin Plates
Multiple Wire Saw To Slice Substrate To Thin Plates
  • Thin Plate Cutting
  • Wire Saw Slicing
  • Substrate Slicing

    • More Services

    Centerless Grinding

    Centerless Grinding
    Polishing To Mirror Surface Finish

    Polishing To Mirror Surface Finish
    Dicing

    Dicing
    Surface Grinding

    Surface Grinding
    Lapping To Controlled Flatness Level

    Lapping To Controlled Flatness Level
    Refurbishing And Reconditioning

    Refurbishing And Reconditioning
    Grooving To Specification

    Grooving To Specification

    Make Appointment

    We would be more than happy to solve your problem and question, please arrange your appointment with us.

     WhatsApp Us

    Direct Call

    Email Us

    WhatsApp Us