Engineering Services
What We Do
Multiple Wire Saw To Slice Substrate To Thin Plates
Dicing
Surface Grinding
Centerless Grinding
Grooving To Specification
Lapping To Controlled Flatness Level
Polishing To Mirror Surface Finish
Refurbishing And Reconditioning
Engineering Product
SAWING/SLICING/DICING
GROOVING/PITCHING/SLOTTING
LAPPING (SINGLE/DOUBLE SIDES)
BUFFING/MIRROR POLISH
English 
Malay