What We Do
Multiple Wire Saw To Slice Substrate To Thin Plates

Dicing

Surface Grinding

Centerless Grinding

Grooving To Specification

Lapping To Controlled Flatness Level

Polishing To Mirror Surface Finish

Refurbishing And Reconditioning

Engineering Product

SAWING/SLICING/DICING

GROOVING/PITCHING/SLOTTING

LAPPING (SINGLE/DOUBLE SIDES)

BUFFING/MIRROR POLISH
